CLUSTER 300

Marked feature

• sputter plant
• 4 chambers (load, pre-etch, 2 process chambers)
• carbohydrate free vacuum
• clean room conditions for substrate handling
• suitable for corrosive gases inclusive pure fluorine
• fully automatic process control

Typical substrate

• up to diameter 300 mm

Range of applications

• development of magnetron sputter sources
• development of reactive sputter deposition processes
• development of layer systems for:
  
• optics
• elektronic systems
• sensor engineering
• sample preparation
• test of hardware components